고융점 접착제 목공 파티클 보드 EVA-JF-108을 에지밴딩 200 Ｃ 목재 소재

Hot Selling Online Shop EVA Hot Melt Adhesive WANLI® EVA-JF-108 with Viscosity 70000±10000mpa·s (200℃) for Chip Board Edge Bonding with Lower Cost Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for ...

1500mpa·S 에지밴딩 고융점 접착제 파티클 보드 목공 EVA-JF-202

Factory Directly Supply EVA Hot Melt Adhesive WANLI® EVA-JF-202 with Viscosity 11500±1500mpa·s (180℃) for Chip Board Edge Bonding Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for 3D ...